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Product Details:
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| Product Name: | 3.0W/m.K Thermal Conductivity Silicone Gap Filler For UAV With 2.9g/Cc Density | Composition: | Silicone |
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| Thermal Conductivity: | 3.0W/m.K | Usage Temperature: | -40~150（℃） |
| Thermal Resistance: | 0.3 (℃-in2/W)0.1mm@50psi | Density: | 2.9g/cc |
| High Light: | Two-Part Dispensable Gap Filler,High Thermal Conductivity Gap Filler,Electronics Gap Filler |
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3.0W/m.K Thermal Conductivity Silicone Gap Filler For UAV With 2.9g/Cc Density
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic filler + Silicone | - |
| Color | Green | Visual |
| Density(g/cc) | 2.9 | ASTM D792 |
| Extrudability(g/s) | 5.0 | ISO9048 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥5.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.3 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1014 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 3.0 | ASTM D5470 |
Product feature
■ Thermal conductivity: 1.0-6.0 W/m.K
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Purchasing information
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
Contact Person: Jason Zhan
Tel: +8613923884646
