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Power Supplies Thermal Gap Filler

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
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The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

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Power Supplies Thermal Gap Filler

Power Supplies Thermal Gap Filler
Power Supplies Thermal Gap Filler Power Supplies Thermal Gap Filler

Large Image :  Power Supplies Thermal Gap Filler

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TM300
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200ml each part)
Packaging Details: 50ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part)
Delivery Time: 13-15working days
Payment Terms: T/T

Power Supplies Thermal Gap Filler

Description
Product Name: 3W Thermal Conductivity Silicone Gap Filler Usage Temperature -40~150℃ Composition: Silicone
Usage Temperature: -40~150(℃) Thermal Conductivity: 3.0(W/m.K)
Thermal Resistance: 0.3 (℃-in2/W)0.1mm@50psi Volume Resistivity(Ω.cm): 1.0*10^14
High Light:

Gap Filler Thermal

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Silicone Gap Filler

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Liquid Gap Filler

3W/m.K Thermal Conductivity Silicone Gap Filler Usage Temperature -40~150℃

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color Green Visual
Density(g/cc) 2.9 ASTM D792
Extrudability(g/s) 5.0 ISO9048
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥5.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 3.0 ASTM D5470

 

Thermal conductive gap filler product characteristics:

1. Good thermal conductivity: 1.5W/m.k-7.0W/m.k;
2. Soft, almost no pressure with the device;
3. Low thermal impedance;
4. It can be easily used for automatic operation of dispensing system;
5. Long term reliability;
6. Comply with UL94V0 fire rating.

 

 

Product feature
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

 

Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators

 

Purchasing information
Packing specification: 300ml Cartridge/ 1kg Jar/20kg Pail

 

Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic

 

Storage & Shelf life

Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.

 

Power Supplies Thermal Gap Filler 0

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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