|Place of Origin:||GUANG DONG China|
|Certification:||UL, SGS, ROHS, ISO, TS14969|
|Minimum Order Quantity:||1.0Kiloampere/Kiloamperes|
|Packaging Details:||Needle packaging: 30cc /, 50CC /, 300CC, Bucket packaging: 1KG/pail, 5KG/pail, 10KG/pail, 20KG/pail|
|Payment Terms:||L/C, T/T|
|Supply Ability:||50000 Kiloampere Per Month|
|Features:||Low Viscosity, Good Leveling, Seismic, Good Fire Resistance||Working Temperature:||-50~200℃|
|Certification:||UL RoHS Reach ISO9001||Color:||Pink, Blue, Custom|
|Sample:||Free Samples(No Mail)||Brand Name:||KUAYUE|
|Usage:||Mechanical Protection||Thermal Conductivity:||3.0~4.0W/m.k Or Customize|
|Packing:||Needle Packaging: 30cc /, 50CC /, 300CC, Bucket Packaging: 1KG/pail, 5KG/pail, 10KG/pail, 20KG/pail|
heat conductive glue,
thermal conductive silicone glue
HCG heat conducting gel is a soft silicone base heat conducting gap filling material with high heat conductivity, low interface heat resistance and good contact variability. It is an ideal material for application in large gap co-difference situations. It is filled with electronic components that need to be cooled. And radiator / shell, etc.. The thermal conductive gel can be painted by hand or by point adhesive equipment.
HCG300 Thermal conductive silicone gel data
|HCG30 Thermal conductive gel product parameter list:|
|Product Performance||Test Results||Test Method|
|Extrusion speed(30cc EFD cartridges 1 "office 90psi)||8.0g/min||--|
|Proportion||3.1g/cm3||Helium true density method|
|Volume resistance||>1013Ωcm||ASTM D257|
|Thermal conductivity||3.0-4.0W/mK||ASTM D5470|
|Dielectric breakdown strength||>200 VAC/mil||ASTM D149|
|Dielectric constant||5.5@1MHZ||ASTM D150|
|Minimum interface thickness||0.09mm||--|
|Content of D3 ~ D12 precipitated by small Silicon molecules||<300PPM||GB/T 27843-2011|
|Thermal expansion coefficient||175ppm/K||ASTM E831|
1. High thermal conductivity, low thermal resistance, excellent wetting
2. Soft, stress-free, infinitely compressed to a minimum of 0.1 mm
3. No settlement, no flow, can fill any uneven gap
4. Convenient design and application, with automatic glue machine can adjust any thickness size
5. Meet ROHS and UL environmental requirements
Q1. Can we get some free samples from you?
A: Yes, you can get some free samples, but the shipping cost of samples should be paid by you.
A:We have obtain UL, SGS, ROHS ISO and REACH certificattes, approved by third party with testing report. we can provide you with the testing report of thermal conductive matrials to ensure our product quality.
A: We have thermal conductive silicone pad with different thermal conductivity including HC100, HC150, HC200, HC250,HC300,HC400,HC500, HCP100. And we have thermal conductive adhesive tape: HCT with PET as base material and HCTM without PET as base material. We also have thermal conductive graphite sheet apply in different electronic industries. GSH is apply on smart phone, GSB is for laptop , and GSM is for LED.
A: Yes , all the thermal conductive materials except HCP series, thickness no more than 0.5mm can add fiberglass as carrier.
A: Our products are widely used in various industries, including poower supply, LED lights, laptop, LED TV, Set top box, communication, heat transfer, chip IC, automotive electronics and photoelectricity etc.
A: Our thermal conductive silicone pad use silicone rubber as based material. The service life of silicone pad depend on the service life of silicone rubber. The silicone rubber industry recognizes a 20-year life for silicone rubber when used within specified operation parameters.
A: The shelf life is a measurement of stable storage life in specified storage conditions. Shelf life for thermal conductive gap filler pad is one year after date of manufacture. For thermal conductive gap pad with adhesive, the shelf life is six months after the date of manufacture. After these dates, inherent tack and adhesive properties should be re-characterized.
A: Yes, all our thermal conductive materials are isolating with the voltage endurance over thousands of volt.